Solder Paste

To compliment our range of plate solders we have available a comprehensive range of solder pastes.

This range is imported from the United Kingdom where it has been well established for many years.

Binder Charcteristics

HIAF – FLUXING RANGE: 535-875 deg C.
Paste deposit is not mobile and can therefore be used on narrow shoulders.
Its drying characteristics are occasionally employed to hold small items in position prior to heating.

About Solder Pastes:

· These are now commonly used for most repetitive types of applications. They are generally considered to be more economical than plate solder especially with the “non-drying formula” which is ideal for infrequent applications.

· The 2gm size is excellent for the less popular alloys or as a trial size to determine the suitability of a particular binder for your application.

· With these technically advanced formulations you can expect full penetration and solid joints with ease, every time.

· All alloys are cadmium free.